e4 - precious metal (e.g., silver (Ag), gold (Au), nickel-palladium (NiPd), nickel-palladium-gold (NiPdAu) (no tin (Sn)).e2- tin (Sn) alloys with no bismuth (Bi) nor zinc (Zn), excluding tin-silver-copper (SnAgCu) alloys in e1 and e8.e1 - tin-silver-copper (SnAgCu) with silver content greater than 1.5% and no other intentionally added elements.e0 - contains intentionally added lead (Pb).JEDEC J-STD-609 Pb-free finish categories describing the lead-free (Pb-free) terminal finish/material of components and/or the solder paste/solder used in board assembly are: TI’s packing labels that use Pb-free logo indicates the product meets both the Pb-free finish requirements and uses a material set rated for lead-free reflow processes per J-STD-020 revision C or later. TI was a leading committee member of this standard during its development and release, and has been shipping products with labeling requirements based on this standard since June 1, 2004. The Joint Electronic Device Engineering Council (JEDEC) standard J-STD-609 was released in July 2007 to give the electronics industry standard labeling requirements for external lead finishes and solder ball/solder bumps.
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